| abstract |
(57) [Problem] To provide a thermoplastic resin composition capable of obtaining a resin molded product having high adhesion to metal and low permeation of moisture. SOLUTION: (A) a melting point of at least one selected from an aromatic polyamide resin, a liquid crystal polymer resin, and at least one styrene polymer having a syndiotactic structure; 0 ° C. or higher thermoplastic resin, (B) at least one of an ethylene copolymer composed of ethylene, an α, β-unsaturated carboxylic acid alkyl ester and maleic anhydride, and a polyamide 46 resin, and (C) an inorganic filler Consists of The thermoplastic resin composition having such a composition can mold a molded article having good adhesion to metal and moisture resistance with good moldability. |