| abstract |
PROBLEM TO BE SOLVED: To provide a printed wiring board insulating layer having sufficient adhesion to a copper plating film forming a conductor circuit after curing without impairing the excellent dielectric and mechanical properties of polyphenylene ether resin. To provide a resin composition suitable for forming. (A) a low-molecular-weight polyphenylene ether reaction product obtained by reacting a modified polyphenylene ether with a phenolic compound in the presence of a reaction initiator; (B) triallyl isocyanurate and / or triallyl cyanurate, (c) a graft copolymer resin of a rubbery elastomer and acrylonitrile and a vinyl aromatic compound, and (d) silica, Component (a) is 1 to 9 based on 100 parts by weight of the sum of component (b). A curable polyphenylene ether-based resin composition containing 9 parts by weight, 99 to 1 part by weight of the component (b), 1 to 90 parts by weight of the component (c), and 1 to 38000 parts by weight of the component (d). |