Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_539114d4a18d97e061762ab21fe3496e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5399 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 |
filingDate |
2001-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9884c9a7fbbd1b3e41656bc98afe2963 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c96ebb3760a47a99bd1298d4698876e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d84bebf54205809795d75868a668a9d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e50e9c1d3d9f15f3bad50adb13882114 |
publicationDate |
2002-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2002105174-A |
titleOfInvention |
Flame retardant epoxy resin composition and use thereof |
abstract |
(57) [Problem] To provide a flame-retardant epoxy resin composition containing no harmful substances such as halogen and antimony. SOLUTION: The present invention relates to a flame-retardant epoxy resin composition, which comprises the following compounds as its characteristics: (A) at least one epoxy resin; (B) the following general formula (B) used as a curing agent for an epoxy resin: Heterocyclic compounds containing phosphorus and nitrogen represented by I): In the formula, m represents an integer of 0 to 2, and n represents an integer of 3 to 7. However, at least one of m does not represent 2. |
priorityDate |
2000-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |