| abstract |
(57) [Problem] To quickly cure during heat molding to give a high-quality molded product, and have good moldability, and can be stably stored at about room temperature for a long period of time. Provided is an epoxy resin composition for a laminate. SOLUTION: Epoxy resin (A), epoxy resin curing agent (B) selected from polyamine, polyphenol or acid anhydride, phosphonium compound which is a salt or complex salt of tetra-substituted phosphonium and a specific polyhydroxy compound ( C) is an essential component. |