| abstract |
(57) Abstract: Provided is a printed wiring board capable of reducing loop inductance and a method for manufacturing the printed wiring board. SOLUTION: Since a chip capacitor 20 is arranged in a printed wiring board 10, a distance between an IC chip 90 and the chip capacitor 20 is shortened, and a loop inductance can be reduced. Further, since the chip capacitor 20 is accommodated in the thick core substrate 30, the printed wiring board does not need to be thick. |