http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002100860-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41F15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2000-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db8691b47a785ba14710444ac381ceff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97a7a5dd9ed6a7a950449f88441455da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fc4ce0428e750e82131bef4501a0978 |
| publicationDate | 2002-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002100860-A |
| titleOfInvention | Manufacturing method of printed wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board capable of appropriately forming a solder bump on a solder pad. SOLUTION: A pattern opposite to a solder pad pattern is formed on a mask 96. This mask 96 With respect to the opening diameter of the solder pad, It is shifted in the range from 40% to 40%. Then, the transfer solder paste 76 is transferred via the mask 96 and reflowed to form the solder bumps 78. Thus, the formation of voids in the transfer solder paste 76 can be prevented, so that solder bumps can be appropriately formed on the solder pads 75a and 75b. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006173325-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010123833-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4544982-B2 |
| priorityDate | 2000-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.