http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002097341-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e68986eea33a9a52657d643ff8a5bc66 |
| publicationDate | 2002-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002097341-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] An area mounting type semiconductor device which is small in warpage at room temperature and in a soldering process and has excellent reliability such as solder resistance and temperature cycle resistance due to excellent adhesion to gold plating and solder resist. To obtain an epoxy resin composition for semiconductor encapsulation suitable for: SOLUTION: 30% by weight or more of the epoxy resin of the formula (10) in the total epoxy resin, 30% by weight or more of the phenol resin of the formula (11) in the total phenolic resin, a curing accelerator, 8 in the compound of formula (12) and the total epoxy resin composition An epoxy resin composition containing 0 to 90% by weight of fused silica as an essential component. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014111704-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005080502-A1 |
| priorityDate | 2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.