http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002096339-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be92719b856db86c092cc233e9512ca2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate | 2000-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47a3d29ece0a98b53225edd1e4c0f3ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd381cc9eb5f25435025b79f0af62fa9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4579f15eaf3f34e1e4d0c851b24a5976 |
| publicationDate | 2002-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002096339-A |
| titleOfInvention | Resin functional element and method of manufacturing the same |
| abstract | (57) Abstract: A resin capable of improving the controllability of adhesion and suppressing the occurrence rate of peeling failure between a resin substrate and a photocurable resin at the time of mold release after photocurable resin molding. It is an object of the present invention to provide a manufactured functional element and a method for manufacturing the same. A photocurable resin that is cured by ionizing radiation between a resin base material (11) having a shape substantially similar to the final shape and transmitting ultraviolet light, and a mold (12) for reversely transferring the final shape to the resin substrate (11). 13 is present, and in a resin functional element formed by subjecting this resin to curing treatment by irradiating ultraviolet light from the resin base material side and a molding method thereof, the adhesive force between the resin base material and the photocured resin after the curing treatment Is characterized in that a physicochemical treatment is applied to a portion of the resin base material that comes into contact with the photocurable resin so that the adhesive strength between the mold transfer surface and the photocurable resin after the curing process is higher. . |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009110185-A1 |
| priorityDate | 2000-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.