| abstract |
[PROBLEMS] To provide a semiconductor device and a method of manufacturing the same capable of reducing the warpage of a wafer and improving the yield in a wafer-level CSP structure. SOLUTION: By forming an insulating film 4, a sealing film 7 or an interlayer insulating film 10 from a resin having an elastic modulus of 20 to 200 kg / mm 2, the warpage of a wafer, which has conventionally been a problem, is greatly reduced. Improve manufacturing yield. A resin formed by curing a liquid bismaleimide resin is used as a resin for realizing the low elastic modulus. The resin thus formed has low elastic modulus, high heat resistance and superhydrophobic properties, so that the reliability can be greatly improved. |