| abstract |
(57) [Summary] (Solution) [Solution] In an epoxy resin composition containing (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler as essential components, the following formula (1) and A light-transmitting epoxy resin composition, which satisfies both (2). [{2 (n A 2 + n C 2) - (n A + n C) 2} / 2] 1/2 < 3.0 × 10 −3 (1), [｛2 (f A 2 + f C 2 ) − (f A + f C ) 2 ｝ / 2] 1/2 <1.0 × 10 −5 (2) Effect The epoxy resin composition of the present invention has a cured product that maintains high transparency under various temperature environments. And has excellent heat resistance, moisture resistance and low stress properties. By using this as an interface adhesive for optical semiconductor encapsulation, it functions effectively under various temperature environments. |