| abstract |
(57) [Problem] To provide an electronic component capable of favorably bonding a gold wire on a copper pad of a substrate and forming a solder bump favorably. SOLUTION: Nickel films 22 and 25 are formed on copper pads 21 and 24 of a substrate 11, and further nickel films 22 and 25 are formed. Gold films 23 and 26 are formed thereon. In order to suppress the formation of a compound of gold and tin that impairs the reliability of soldering, the formation of the gold films 23 and 26 on the nickel films 22 and 25 is performed by a very thin displacement plating method. As a result, the solder bumps 17 can be formed favorably. After the nickel oxide film 32 formed on the surface of the gold film 23 is removed by plasma etching, wire bonding is performed. As a result, the bonding of the wire 15 can be performed well. |