| abstract |
PROBLEM TO BE SOLVED: To improve a conductive property in a curable silicone composition for preparing a silicone adhesive. SOLUTION: (A) an organopolysiloxane containing, on average, at least two silicon-bonded hydroxy groups per molecule; (B) at least one silane having the formula R 2 n SiX 4-n wherein R 2 is , C1 to C8 monovalent hydrocarbon or monovalent halogenated hydrocarbon group, n is 0 or 1, X is -OR Consists of 2 or -OCH 2 CH 2 OR 2) or a partial hydrolyzate thereof crosslinking agent; (C) at least an outer surface of silver, gold, platinum, palladium, or conductive filler include particles consisting of nickel (D) having a molecular weight of up to 1000 and comprising at least one hydroxy group per molecule; It is prepared by mixing a catalytic amount of a condensation catalyst comprising a hydroxy-functional organic compound which does not substantially inhibit the curing of the composition; and (E) a metal salt of a carboxylic acid. |