| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2000-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e7b874431fb9fc91fa0ab7defeacf91 |
| publicationDate |
2002-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002076185-A |
| titleOfInvention |
Circuit board device and method of manufacturing the same |
| abstract |
(57) Abstract: A circuit board in which a wiring board having conductive bumps formed at a narrow pitch on wirings arranged at high density and an electronic component are connected with high connection reliability and weather resistance. Providing equipment. A wiring board includes an insulating base material and wiring provided on the bare chip side of the insulating base material. And a protrusion 34a provided on the insulating base material 31 and having a tip portion reaching the gap between the wiring board 30 and the bare chip 20 and formed of the second resin. Metal film 34b continuous with 32 And a conductive bump 34 having the following. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017204660-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008028361-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010232663-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8258620-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10276486-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011181923-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109076714-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109076714-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005026598-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012513109-A |
| priorityDate |
2000-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |