| abstract |
(57) [Summary] (with correction) [PROBLEMS] To provide a contact component for a wafer batch contact board, which further improves the positional accuracy of an isolated pad and an isolated bump, and a method of manufacturing the same. SOLUTION: In order to reduce the elongation of the contact portion of the insulating film 32 due to the ring 31 at the contact portion in the wafer batch contact board used for collectively testing a large number of semiconductor devices formed on the wafer, the insulating film 32 is provided. Avoid the isolated pad 34 and / or the isolated bump on the front and / or back surface of the The remaining pattern 35 is formed so as to be less than m%. |