abstract |
[PROBLEMS] To provide a cured product having excellent flexibility, heat resistance to soldering, heat degradation, electroless gold plating resistance, development with an organic solvent or a dilute alkaline solution, solder resist and interlayer insulating layer. The present invention provides a resin composition suitable for: SOLUTION: An epoxy compound (a) having two epoxy groups in a molecule is reacted with an unsaturated monocarboxylic acid (b) and then reacted with ε-caprolactone (c). Polyimide Precursor (d) A resin composition containing an oligomer (A) obtained by reacting a polyol compound (e) as an optional component with a diluent (B). |