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filingDate 2001-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002069271-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and is excellent in moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability, and solder crack resistance. To provide. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) a zirconium oxide compound represented by the general formula (1), and (F) red. An epoxy resin composition for encapsulating a semiconductor, comprising a phosphorus or red phosphorus flame retardant as an essential component. ZrO n H m (1) (where n is 2 to 4 and m is 0 to 4)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005336362-A
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