abstract |
(57) Abstract: In a liquid epoxy resin composition containing (a) a liquid epoxy resin, (b) a curing agent, and (c) an inorganic filler, an inorganic filler containing 50% by weight or more of spherical carbon. A liquid epoxy resin composition for encapsulating a semiconductor, characterized by using an agent. The liquid epoxy resin composition for semiconductor encapsulation according to the present invention provides a highly reliable cured product which is excellent in gap invasion, lightweight and low in elasticity. |