http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002068832-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate | 2000-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5535cd93a2e03de123130e57d2ca5ba8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28525ffe4ab679b77fd9179aa48ccdfe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c02d255be47e6c293d96407fa1149e94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab7b25e34f56e52c865576a488b5839e |
| publicationDate | 2002-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002068832-A |
| titleOfInvention | Glass ceramic sintered body and multilayer wiring board using the same |
| abstract | (57) [Abstract] (Modified) [Problem] A glass ceramic sintered body having a high dielectric constant and a low tan δ, which can be co-fired with a high thermal expansion glass ceramic sintered body, and an organic resin as an insulating material. A wiring board having excellent reliability in mounting on a printed board and incorporating a capacitor is obtained. The thermal expansion coefficient at 40 to 400 ° C. is 6 to 6. A glass component of 18 × 10 −6 / ° C. comprises 50 to 70% by volume of a filler component and 30 to 50% by volume of a filler, wherein the filler components are a) lanthanum titanate, b) magnesium titanate, and c) titanic acid. A salt and d) a zirconium-containing oxide having a coefficient of thermal expansion of 8 at 40 to 400 ° C. At least one layer 1b is used as the inner layer of the multilayer wiring board, using a glass-ceramic sintered body having a relative dielectric constant of 14 × 10 −6 / ° C. or more and a relative dielectric constant of 1 MHz to 3 GHz of 14 or more and a tan δ of 1 MHz to 3 GHz of 25 × 10 −4 or less. By forming metallized electrodes 3 on the upper and lower surfaces of the layer, a capacitor is built in the multilayer wiring board 1. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002326863-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005039243-A |
| priorityDate | 2000-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.