abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and is excellent in moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability, and solder crack resistance. Providing things. SOLUTION: It is essential that (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound, and (F) magnesium hydroxide are essential components. Characteristic epoxy resin composition for semiconductor encapsulation. |