| abstract |
(57) [Problem] To provide a wire for a multi-wire wiring board which can cope with high density without generating voids or peeling. SOLUTION: An insulated wire for multi-wire wiring (wire) having a core wire as a conductor, an insulating layer covering the core wire, and an adhesive layer further covering the insulating layer, The softening point of the adhesive layer in the B stage state is 30 to 100 ° C. And the glass transition point after curing is 180 ° C. or higher. Further, the glass transition point of the wiring board for wiring wires and the adhesive coating film on the surface thereof is set to 160 ° C. or higher. |