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filingDate 2001-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002050638-A
titleOfInvention Method of forming fully self-aligned TFT with improved process window
abstract (57) [Problem] To provide a method of opening a resist in a raised region of a semiconductor device. The method includes forming a conductive layer on a channel insulating layer and forming a raised portion above a substantially planar peripheral region. A photoresist layer is formed on the raised portion and the surrounding area, and after developing the photoresist, the photoresist remains on the upper surface of the raised portion, A pattern is formed in the photoresist by reducing the amount of exposure to the photoresist on the conductive layer on portions raised by the grayscale photomask so that it does not remain in the surrounding area. The conductive layer is etched according to the photoresist to form source / drain electrodes that are self-aligned with the channel insulating layer.
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