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filingDate 2000-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002043761-A
titleOfInvention Flexible multilayer wiring board
abstract (57) [Problem] To provide a product having good productivity, low cost, and high connection reliability. SOLUTION: In the flexible multilayer wiring board of the present invention, the first conductive pattern 5 provided on the first flexible insulating substrate 2 and the second conductive pattern provided on the second flexible insulating substrate 12 are the first conductive pattern. Since the first conductive material 23 filled in the through-holes 2a is used to conduct, the flexible multi-layer wiring has good productivity, is inexpensive, and has high connection reliability as compared with the conventional gold-plated one. A substrate can be provided.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010267830-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013251343-A
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