http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002043709-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2000-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41abccd6e0bf2cda9dc09aa99125a864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3341dbafeaee1fe6d04492dc3fb5e7fa |
| publicationDate | 2002-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002043709-A |
| titleOfInvention | Wiring board forming material and its manufacturing method, and wiring board and its manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide a wiring board forming material capable of forming an insulating layer having a high uniformity of thickness and a wiring layer of a fine pattern and obtaining a wiring board with high connection reliability, a method of manufacturing the same, and a method for manufacturing the same To provide a wiring board using the wiring board forming material and a method for manufacturing the same. SOLUTION: The wiring board forming material of the present invention is formed on a support plate, a metal layer releasably provided on the support plate, an adhesive resin layer provided on the metal layer, and an adhesive resin layer. Done, Having a plurality of conductors extending through the thickness direction thereof, The adhesive resin layer is formed by electrodepositing a polyimide resin material on a metal layer. In the present invention, an insulating layer and a short-circuit portion penetrating in a thickness direction thereof are formed by thermocompression bonding of two of the wiring board forming materials or thermocompression bonding of the wiring board forming material to a core substrate. Is etched to form a wiring layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016191049-A |
| priorityDate | 2000-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 330.