| abstract |
(57) [Problem] To reduce the occupied area by efficiently arranging each unit (equipment) for continuously performing a plating process and processes accompanying the plating process in the same facility, and to use the plating process and the like. Provided are a plating apparatus and a method capable of preventing contamination of a substrate by a chemical. SOLUTION: A cassette stage 15 for mounting a cassette for accommodating a substrate in a facility 10, a pre-processing unit 21 for pre-processing the surface of the substrate, and the pre-processing unit 21 A plating processing unit 22 for plating the surface of the substrate pre-processed in the first stage, first substrate stages 23 a and 23 b for mounting the substrate between the cassette stage 15 and the pre-processing unit 21, and a substrate after plating A cleaning / drying device 16 for cleaning and drying the substrate with pure water is provided, and transporting devices 17 and 24 for transporting the substrate between the respective devices are provided in the facility 10. |