http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002038240-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8de772e5c6c44844b546733f251fc2bc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C38-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C38-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C38-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16F1-02 |
| filingDate | 2000-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4eb6dcf1699dfc687daf1972f66d89e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59e0358681c5a75e3787694511cad9f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18c3bea1a8cc254f45a98897d38d4fd7 |
| publicationDate | 2002-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002038240-A |
| titleOfInvention | Stainless steel battery holding spring |
| abstract | (57) [Summary] [Object] To obtain a stainless steel battery pressing spring having low contact electric resistance and improved solderability by dispersing and depositing a Cu-rich phase and enriching Cu in a passivation film or the outermost layer. [Constitution] Based on stainless steel containing 1.0 mass% or more of Cu, and a second phase mainly composed of Cu dispersed and precipitated in a matrix at a ratio of 0.2 volume% or more, a passivation film is formed. The second phase mainly composed of Cu is exposed on the surface of the base material through the intermediary of the second phase. Stainless steel in which the second phase mainly composed of Cu is not dispersed and precipitated can also be used. In this case, however, C is determined based on the concentration of Cr, Si, and Mn in the passivation film or the outermost layer on the substrate surface. The concentration ratio of u concentration is Cu / (Cr + Si) ≧ 0.1, Cu Adjust (Si + Mn) ≧ 0.5. Solderability is This is further improved when the dispersion and dispersion of the Cu-based second phase and the concentration of Cu in the passivation film or the outermost layer are combined. |
| priorityDate | 2000-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.