| abstract |
PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition having excellent flame retardancy without using a halogen-based compound or a phosphorus-based flame retardant, and a semiconductor sealing material using the same. . An epoxy containing an unhalogenated epoxy resin (A) having at least two epoxy groups in one molecule, a curing agent (B), a hydroxide (C), and a metal nitrate (D) as essential components. An epoxy resin composition, wherein the hydroxide (C) has an average particle size of 1 to 0.05 μm, and the flame-retardant epoxy resin composition and a filler. A semiconductor sealing material that is basically composed. |