| abstract |
(57) [Summary] A gap between an upper surface of an electronic component and a bonding wire cannot be maintained, and a portion other than a connection portion on the upper surface of the electronic component comes into contact with the bonding wire, and the upper surface of the electronic component is adjacent to the upper surface. Short-circuiting between the electrodes, and when the bonding wire was crimped to the electrodes of the electronic component, a direct impact was applied to the electrodes of the electronic component, resulting in deterioration of the function of the electronic component or damage to the electronic component To eliminate. A bonding wire (4) extends in a substantially horizontal direction from a conductor bump (6) on an electrode (5) and is bent so as to extend in a substantially vertical direction from a wiring conductor (3). 4 is covered with a resin coating material 7. |