| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_482700716d8dd893e9376b49d7a9f931 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04M1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R19-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R3-00 |
| filingDate |
2000-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4f490ee8c1ce3859400f45fe5b7b92b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d9024d0304f25477dae5c1d9385927f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5acb8f17ec61b7b8120477216d716013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0029dcbe488d60833f7e2f02e8bb5ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfeaab637d151045d7f75a1dc6456ef6 |
| publicationDate |
2002-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002016999-A |
| titleOfInvention |
Electret condenser microphone and portable electronic device using the same |
| abstract |
(57) [Abstract] [Purpose] It is possible to improve the sensitivity by using a package that has the smallest possible dimensional tolerance and a flexible shape, and stabilizes the positional relationship between both the package and the cap. It can be so. The semiconductor device includes a vibration film, a semiconductor chip on which necessary electronic circuits are formed, a package for accommodating the semiconductor chip and the vibration film, and a cap for covering the package. The package 100 is obtained by insert-molding a lead frame 200 in an insulating resin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100753913-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7945062-B2 |
| priorityDate |
2000-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |