| abstract |
(57) Abstract: An epoxy resin composition suitable for a sealing material, a molding material, a casting material, an adhesive, and a material for an electrically insulating paint used for a copper-clad laminate used for an electronic circuit board and an electronic component. And Provided is an epoxy resin composition which provides a laminate excellent in heat resistance, flame retardancy, flexibility and adhesion. A phosphorus-containing epoxy resin (A) and a curing agent (B) are prepared by reacting a phosphorus compound represented by the formula (1) with a curable epoxy resin so that the phosphorus content becomes 0.8 to 8% by weight. ) And a block copolymer (C) formed from a phenolic hydroxyl group-containing aromatic polyamide oligomer having aminoaryl groups at both terminals and a poly (butadiene-acrylonitrile) copolymer having carboxyl groups at both terminals. Flame-retardant epoxy resin composition. Embedded image (R is a hydrogen atom, an aliphatic group, or an aromatic group, and may be the same or different) |