abstract |
(57) [Problem] To provide a resin bonding composition for die bonding that can reduce the occurrence of reflow cracks during solder reflow of a semiconductor device and improve the reliability. SOLUTION: A resin paste composition obtained by uniformly dispersing (A) a butadiene oligomer, (B) an acrylate or methacrylate, (C) a liquid rubber component, (D) a radical initiator, and (E) a filler. object. |