patent/JP-2002009228-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002009228-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-01
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
filingDate	2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_316a937486564bca65da78d646137bb9
publicationDate	2002-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-2002009228-A
titleOfInvention	Semiconductor device
abstract	(57) Abstract: Provided is a semiconductor device having a three-dimensional mounting module configuration using a flexible circuit board having a high degree of freedom in layout in which measures for heat radiation in an assembling stage are easy. A mounting area of a flexible circuit board is provided. 1, 112, and 113 mainly include electronic components 121, 122 and 123 are mounted correspondingly. In the flexible circuit board 13, the mounting regions 111 to 113 are arranged above the base region 110 in the order (f1 to f It is configured to be folded in 3). The electronic component 122 is an IC that emits the least heat when operating. The electronic components 122 and 123 are ICs that operate with a greater degree of heat radiation than the electronic component 122.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9523702-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9702890-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10072954-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I470762-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10107653-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8960000-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103219326-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8299848-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9250260-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11709079-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9243909-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9316499-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101755335-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9404755-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10113875-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009017070-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10612948-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017094044-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017085877-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5600939-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9052220-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9541397-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9468994-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8436680-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11215484-B2
priorityDate	2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57420512 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452198021

Total number of triples: 44.