http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002003703-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2000-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c570f059efb157410e1e41de524a290d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d70ab8ad20ce2e3455ea786b12c6e3f6 |
| publicationDate | 2002-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002003703-A |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for encapsulation capable of improving resistance to solder cracking caused by moisture absorption. SOLUTION: It contains an epoxy resin, a curing agent, an inorganic filler, and a coupling agent. It is a sealing epoxy resin composition used for sealing an element mounted on a lead frame plated with palladium or palladium / gold. It contains an epoxy resin having the following structural formula (1). Contains a silane compound having a primary amino group. The moisture absorption of the sealing resin can be kept low, and the adhesion between the sealing resin and the lead frame can be increased. Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021089466-A1 |
| priorityDate | 2000-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.