| abstract |
(57) [Abstract] (with correction) [PROBLEMS] To obtain a flux that gives a high spread rate to a lead-free solder such as a tin-silver solder and does not contain a halogen element. SOLUTION: A flux having a composition of 5 to 20% by weight of an activator comprising a mixture of two or more compounds selected from the group of oxy acids, carboxylic acids and anilides and 80 to 95% by weight of rosin, and filling the flux Soldering iron-based solder. |