http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001526395-A
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-04 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02 |
filingDate | 1998-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2001-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2001526395-A |
titleOfInvention | System with mechanical alignment mechanism for semiconductor chip scale packages and dice |
abstract | SUMMARY An inspection system (28) for inspecting a semiconductor component (30A), such as a die (10) having a raised portion and a chip scale package (14), is provided. The inspection system (28) includes a base material (32) for holding one or more components (30A) and an internal connection member (36) for temporarily electrically connecting to each component (30A). ). In addition, the inspection system (28) includes an alignment means (48) having an alignment surface for aligning the component (30A) with the internal connection member (36). The component (30A) may include an alignment member such as a beveled edge (72A), ridge (72B) or post member (72C) configured to interact with the alignment surface. it can. The alignment means (48) is formed as a polymer layer (48A), such as a layer of resist, which is deposited, developed and cured by a wafer stage manufacturing process. The alignment surface is an opening (50A) in the polymer layer (48A) and is configured to engage an edge of the component (30A) or its alignment member. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010061888-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5260678-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8633724-B2 |
priorityDate | 1997-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.