| abstract |
SUMMARY OF THE INVENTION The present invention relates to annealed electrodeposited copper foil, which has a substantially uniform and non-oriented grain structure, wherein the essentially cylindrical grains are comprised of particles. Rather, the copper foil is characterized by a fatigue ductility of at least about 25% after annealing at 177 ° C. for 15 minutes. In one embodiment, the copper foil is annealed, and the copper foil is characterized by at least about 65% fatigue ductility. The present invention also relates to a method for producing electrodeposited copper foil using an electrolyte solution characterized by a critical chloride concentration of up to about 5 ppm and an organic additive of up to about 0.2 ppm. |