| abstract |
(57) [Summary]nThe described deposition system was designed to accommodate new precursors and chemical processes used for transport polymerization and chemical vapor deposition. The system mainly consists of a reactor, a liquid injector or gas mass flow controller, a cracker, and a sub-atmospheric pressure deposition chamber. Crackers utilize one or more types of energy, including heat, photons, and plasma. The present invention relates to F-PPX (poly (paraxylylene fluoride)) for intermetal dielectric (IMD) and interlevel dielectric (ILD) applications in the manufacture of integrated circuits with features of size less than 0.25 μm. ) And other fluorinated polymer thin films. |