| abstract |
(57) [Summary]nThe present invention provides a multilayer printed circuit board, the structure of which comprises a plurality of layers (a) to (c) to achieve the desired number of layers: (a) a bottom circuit layer, ( b) Via-hole interconnect layer, (c) Top circuit. Another aspect of the invention is directed to a multi-layer printed circuit board having elements or dies attached thereon, the structure comprising: (a) a single or multi-layer printed circuit board substrate; and (b) a via-hole interconnect layer. Has a conductive adhesive composition patterned in a suitable conductive material, the suitable conductive material providing the bond between the printed circuit board and the element or die, while the conductive adhesive composition Provides electrical interconnection and bonding between the connection pads of the printed circuit board substrate and the attached elements or dies), (c) area array element mounts or bare dies (which are suitably patterned and conductive as described above). Attached to the printed circuit board layer using a material). |