http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001507404-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-505 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48 |
| filingDate | 1997-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2001-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001507404-A |
| titleOfInvention | Flux agent for electrodeposition tin plating reflow |
| abstract | (57) [Abstract] This is a composition used as a flux material in a tin plating process. Wherein M is a cationic species, preferably H, substituted or unsubstituted ammonium, alkali metal, alkaline earth metal or tin, R is H, C 1 -C 6 linear or branched alkyl, alkoxy or alkenyl, Or aryl (optionally substituted), m is 2 or 3, n is 0, 1 or 2, when n is 0, R is H and at least one SO 3 M or It must contain a substituent of OSO 3 M. A composition comprising an aqueous solution of one or more hydroxyphenyl compounds of formula I, wherein the composition comprises from about 0.1 gram / liter up to saturation of the compound of general formula I above. Is disclosed. Also disclosed is a method of treating matte tin plating and a method of tin plating using such a composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019516781-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11788228-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11225756-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11773537-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11008284-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11450854-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022000431-A |
| priorityDate | 1996-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.