http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001354750-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2000-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c582af4953dc949de558535887f88655 |
| publicationDate | 2001-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001354750-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition excellent in moldability, solder crack resistance, and flame retardancy. SOLUTION: (A) Epoxidized modified phenolic resin obtained by polycondensation of petroleum heavy oil or pitches, formaldehyde polymer and phenols in the presence of an acid catalyst, (B) phenolic resin curing An epoxy resin composition for semiconductor encapsulation comprising, as essential components, an agent, (C) an inorganic filler, and (D) a curing accelerator. |
| priorityDate | 2000-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.