| abstract |
(57) [Problem] To provide a multilayer printed wiring board that can be directly electrically connected to an IC chip without using a lead component. SOLUTION: The multilayer printed wiring board has an IC chip 20 built in a core substrate 30 in advance, and a die pad 24 of the IC chip 20 has a first thin film layer 33 and a second thin film layer 3 mounted thereon. 6. A transition layer 38 comprising a thick film 37 is provided. Therefore, the electrical connection between the IC chip and the multilayer printed wiring board can be established without using a lead component or a sealing resin. Further, by providing the three transition layers 38 on the die pad 24, resin residue on the die pad 24 can be prevented, and the connectivity and reliability between the die pad 24 and the via hole 60 are improved. |