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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06
filingDate 2000-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_390989dcdc42e292831fd741332e8165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a4910b79664a4f343a01e2cd3451c5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffaa8362dccf51ceab3721ecb2e8bc17
publicationDate 2001-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001348428-A
titleOfInvention Polyamic acid composition, soluble polyimide composition and polybenzoxazole-polyimide composition
abstract (57) Abstract: A resin having a low dielectric constant and heat resistance is provided. A polyamic acid composition comprising a repeating unit represented by the following general formula (1). Embedded image (Wherein R 1 and R 2 are methylene, oxygen, C (CH 3 ) 2 , C (C F 3 ) 2 represents one of COO groups. R3 is a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a (meth) acryloyloxyethyl group, a (meth) acryloyloxy n-propyl group, a (meth) acryloyloxy i-propyl group, a (meth) acryloyloxy n Represents any one of -butyl groups. R4 represents a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an ester group, a carboxyl group, or a hydroxyl group. R 5 is a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, R6 -CO group and R6-OCO group are shown. R6 represents a hydrocarbon group having 1 to 4 carbon atoms. p and q each represent an integer from 0 to 2. r and s represent 0 or 1. )
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priorityDate 1999-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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