| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2000-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6994eadcc997ad511c4f5b9e74e8526
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b52656d252aa893863e5f4435135f00b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4913f7ef2d301242f3acd18d39220062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31989ca23e030f274594509383bfe337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2b63b656e14497d0b9d3c0445603ffd |
| publicationDate |
2001-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001342600-A |
| titleOfInvention |
Surface roughened copper, method for producing the same, and printed circuit board using the same |
| abstract |
(57) [Summary] (with correction) [Problem] To easily and inexpensively provide roughened copper capable of maintaining the adhesion between a copper foil and a resin. A method for roughening the surface of a copper foil or a copper plate by etching in an electrolytic solution containing a salt, comprising forming an anion capable of forming a hardly soluble compound by reacting with copper ions in the electrolytic solution. Added. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011084801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4492806-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114438579-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007019322-A |
| priorityDate |
2000-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |