| abstract |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in heat resistance and adhesion to a wiring layer and which can be developed with excellent resolution even when using an aqueous developing solution which does not use an organic solvent. Further, the present invention provides a method for producing a multilayer printed wiring board using the composition as an adhesive for circuit layers produced by a build-up method. SOLUTION: A compound (A) having at least one phenolic hydroxyl group and at least one acryloyl group or methacryloyl group in one molecule, an unsaturated imide compound (B), and a photopolymerization initiator (C) are essential. A photosensitive resin composition containing, as a component, an epoxy compound (D) having at least two epoxy groups in one molecule, and a multilayer structure in which wiring layers and insulating layers are alternately formed A multilayer printed wiring board, wherein an insulating layer is made of the photosensitive resin composition. |