| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a bromine compound and an antimony compound, and is excellent in moldability, solder stress resistance, high-temperature storage characteristics, and flame retardancy. . (A) an epoxy resin, (B) a modified phenol resin obtained by polycondensing a heavy petroleum oil or pitches, a formaldehyde polymer and a phenol in the presence of an acid catalyst, (C) an inorganic resin An epoxy resin composition for semiconductor encapsulation, comprising a filler, (D) a curing accelerator, and (E) a cyclic phosphazene compound as essential components. |