| abstract |
(57) [Summary] [Object] To provide a connection device having a contact terminal capable of contacting an inspection object at multiple points and high density, and a method of manufacturing the same. A hole for forming a contact terminal 103 is formed by anisotropic etching of a silicon wafer, and the contact terminal 103, an insulating film 104 made of a polyimide film, and a lead-out wiring are formed by using the mold. 105 To form Further, the insulating film 104 and the wiring board 1 07, the buffer layer 108 and the silicon wafer serving as the substrate 109 are sandwiched and integrated to remove the mold. After that, the lead-out wiring 105 is connected to the electrode 110 a of the wiring board 107 with the solder 111. |