abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability, flame retardancy, high-temperature storage characteristics, humidity resistance and solder crack resistance. Providing a composition. SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, (E) phosphazene compound, and (F) zinc borate (2ZnO · 3B 2 O 3 · 3.5H 2 O) as an essential component. |