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filingDate 2000-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001329144-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability, flame retardancy, high-temperature storage characteristics, humidity resistance and solder crack resistance. Providing a composition. SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, (E) phosphazene compound, and (F) zinc borate (2ZnO · 3B 2 O 3 · 3.5H 2 O) as an essential component.
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