abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability such as fluidity and curability, flame retardancy, soldering resistance and high-temperature storage characteristics. Providing a composition. SOLUTION: (A) Epoxy resin, (B) phenol resin, (C) curing accelerator, (D) inorganic filler, (E) phosphazene compound, and (F) Co, Cu, Zn, N Naphthenic acid, a metal element selected from i, Mn, Fe An epoxy resin composition for semiconductor encapsulation comprising, as an essential component, a metal complex in which a ligand selected from acetylacetonate, phthalocyanine, and thiocyanic acid is coordinated. |