| abstract |
(57) [Summary] [PROBLEMS] To reduce the amount of a cyclic phosphazene compound to be added, the amount of an inorganic filler to be added is small, and excellent fluidity is achieved. Further, to obtain an epoxy resin composition for semiconductor encapsulation which has improved flame retardancy without using a bromine compound or an antimony compound and has excellent solder resistance. (A) an epoxy resin represented by the general formula (1), (B) a phenol resin represented by the general formula (2), An epoxy resin composition for semiconductor encapsulation comprising (C) an inorganic filler, (D) a curing accelerator, and (E) a cyclic phosphazene compound represented by the general formula (3) as essential components. |