| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and has moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability and solder cracking properties. To do. SOLUTION: An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, a metal hydroxide solid solution, and a flame retardant obtained by surface-treating zinc borate with a titanate coupling agent. |