| abstract |
[57] [Problem] To provide a cured product having excellent flexibility, solder heat resistance, heat deterioration resistance, electroless gold plating resistance, development with an organic solvent or a dilute alkali solution, a solder resist and a layer-sensitive insulating layer. A resin composition suitable for use. In one molecule, a terminal acid anhydride group or an isocyanate group-containing imide compound (c), which is a reaction product of a tetracarboxylic dianhydride (a) and a polyisocyanate compound (b), and a polyol (d) are included in one molecule. A resin composition comprising an oligomer (A) which is a reaction product of a (meth) acrylate (e) having one hydroxyl group and a diluent (B). |